Reflow Soldering/Bonding Equipment & Systems
Standalone Basic Hot Bar Bonding System - UniBase
The stand-alone Uni-Base hot bar reflow soldering system is the first in a line of (semi-) automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-bonding. Flexible enough for R&D environments or volume manufacturing where automation is not necessary. Typical product applications are connection of components like an LCD display, small size TFT, glass substrate based OLED, polyimide mounted TCP driver, and a diversity of heat-sensitive components like CCD camera chips.
- Uniflow2 Pulse Heated Control
- High precision motorized or pneumatic bonding head
- Quick Connect Block with pulse-heated Thermo-plane thermode
- Two hand operation for operator safety
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Hot Bar Reflow Product Literature
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Hot Bar Reflow Soldering Resources
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Closed Windowed Flex
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Heat Seal Bonding
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Open Windowed Flex