Reflow Soldering/Bonding Equipment & Systems
Standalone Manual Rotary Hot Bar & ACF Bonding System - UniTurn
The Uni-Turn stand-alone bonding system is designed for use in high mix/low volume production or R&D environments. Product is loaded on one side of the two-position rotary table, while being processed on the other. The stand-alone systems are suitable for Hot Bar Reflow Soldering and Heat-Sealing applications utilizing Pulsed Heat Technology. A tape feeder and tape cutting module can be added for ACF Bonding applications.
- Unflow2 pulse-heated reflow soldering control
- Two-position rotary table
- High precision pneumatic head with programmable speed and force
- Pulse-heated
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Hot Bar Reflow Soldering Resources
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Reflow Application 2
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Telecommunications Display
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Automotive Reflow App