Reflow Soldering/Bonding Equipment & Systems
Thermodes for Benchtop Reflow Soldering & Bonding Heads
- Wide Variety of Tip Shapes and Sizes
- Uniform Heating
- Dimensionally Stable
Miyachi Unitek's three-dimensional (TD) family of thermodes are designed for use with Miyachi Unitek SA Series reflow soldering heads.
Utilized for a number of different reflow soldering and bonding applications, they feature:
Utilized for a number of different reflow soldering and bonding applications, they feature:
- Uniform temperature distribution across the thermode face
- Retain optimal flatness under heating
- Eliminate voltage potential, and have
- Extremely fast heating and cooling to optimize process times
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Hot Bar Reflow Product Literature
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Hot Bar Reflow Soldering Resources
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TD Thermode
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Thermode