Reflow Soldering/Bonding Equipment & Systems

Thermodes for Reflow Soldering & Bonding

Miyachi Unitek offers a variety of thermodes for different reflow soldering and bonding applications. The three-dimensional (TD) family is designed for use with Miyachi Unitek SA Series reflow soldering heads. They feature uniform temperature distribution across the thermode face, retain optimal flatness under heating, eliminate voltage potential, and have extremely fast heating and cooling to optimize process times. Thermo-plane thermodes are designed for use with our high force reflow soldering heads and are thus designed to maintain co-planarity under the high forces resultant of the bonding process. Thermo-plane thermodes feature forced air cooling and, since the current flows front-to-back rather than left-to-right, eliminate voltage drop, preventing damage to sensitive parts.