Reflow Soldering/Bonding Equipment & Systems

Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder or adhesive coated parts are heated to a temperature sufficient to cause the solder or adhesive to melt, flow, and solidify, forming a permanent electro-mechanical bond between the parts.

Typical hot bar reflow soldering applications include flex circuits, ribbon cables, wires, flex to PCB, flex to LCD, and thermocompression bonding of gold ribbon as found in the telecommunications, computer, automotive, display industries and more.

Miyachi Unitek offers a full range of products for hot bar reflow soldering including reflow soldering power supplies, thermodes, reflow bonding heads, and both single operator desktop systems and standalone systems such as those used for flat panel display repair.