Reflow Soldering/Bonding Equipment & Systems
Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder or adhesive coated parts are heated to a temperature sufficient to cause the solder or adhesive to melt, flow, and solidify, forming a permanent electro-mechanical bond between the parts. Read More...
|
|
Pulse Heated Reflow Soldering Power Supply - Uniflow4**NEW** Uniflow4 power supply for pulsed heat hot bar reflow soldering and bonding |
|
|
Thermodes for Reflow Soldering & BondingThermodes for hot bar reflow soldering applications |
|
|
Desktop Hot-Bar Bonding Systems - DT SeriesDesktop systems for hot bar bonding, heat sealing and reflow soldering |
|
|
Standalone Basic Hot Bar Bonding System - UniBaseSemi-automatic standalone system for hot bar reflow soldering, heat sealing and ACF bonding applications |
|
|
Standalone Manual Linear Slide Hot Bar Bonding System - UniSlideLinear slide system perfect for high mix production or R&D environments |
|
|
Standalone Automatic Linear Slide Heat Sealing System - UniSlide PlusStandalone bonding system for applications with oft-changed process settings |
|
|
Standalone Manual Rotary Hot Bar & ACF Bonding System - UniTurnStand-alone rotary bonding system |
|
|
Standalone Automatic Rotary Heat Seal Equipment - UniTurn PlusStandalone automated rotary heat seal system |
|
|
LCD Repair Station - Emerald SeriesSystems designed for flat panel display repair |
GSA Schedule ContractFederal customers learn about our GSA Schedule Contract offering |